Key Capabilities
End-to-end aerospace & defence electronics solutions — from design to deployment.
Design & Engineering
- Layout design & analysis
- Circuit design & development
- EMI/EMC & SI validation
Prototyping
- Rapid prototype development
- TRL 1 to TRL 9 expertise
- Functional validation & optimization
Manufacturing & Assembly
- Layout design & analysis
- Circuit design & development
- EMI/EMC & SI validation
Inspection & Quality
- Automated Optical Inspection (AOI)
- BGA X-ray inspection & rework
- IPC standard quality checks
Testing & Validation
- Functional & performance testing
- Thermal cycling & environmental testing
- Reliability & stability analysis
In-House Facilities
- Advanced SMT lines & equipment
- Conformal coating & harnessing
- End-to-end production infrastructure
Advanced SMT Assembly Infrastructure
SurfaceMount Technology
At Bendra Aerospace, our SMT (Surface Mount Technology) facility is designed to support high-reliability electronic manufacturing for aerospace, defence, and industrial applications
Advanced Reflow Soldering Process
Our Reflow Oven system ensures reliable and defect-free soldering of SMT components through precision thermal profiling and controlled heat distribution. The multi-zone configuration supports stable soldering performance for fine-pitch and high-density PCB assemblies used in mission-critical electronics
High-Precision Pick & Place Capability & Stencil Printer
The SMT line is integrated with high-speed Pick & Place machines capable of accurately placing a wide range of electronic components, from miniature chip components to complex BGA packages. The system is optimized for both prototype development and batch production requirements
Advanced Inspection & Testing
X-Ray with Void Measurement
The X-Ray Inspection Machine is used to inspect hidden solder joints and internal connections of PCB assemblies without damaging the board. It is especially critical for BGA, QFN, and high-density electronic packages used in defence and aerospace systems
Automated Optical Inspection
The AOI machine is used for automatic inspection of PCB assemblies to identify manufacturing defects such as missing components, wrong polarity, soldering defects, alignment issues, and short circuits with high precision.
Comprehensive testing Facilities
Our comprehensive testing facility is equipped with advanced electrical verification instruments, including dedicated testers, LCR meters, and Digital Multimeters (DMMs), to ensure accurate functionality and quality validation of electronic assemblies. Environmental chambers supporting thermal cycling as per MIL-STD environmental qualification standards enable reliability testing of mission-critical aerospace and defence electronic systems under extreme operating conditions
Additional Services for Enhanced Functionality
BGA Rework Station
A precision rework system used for the removal, replacement, and re-soldering of BGA (Ball Grid Array) and other advanced SMT components without damaging the PCB
Conformal Coating Inspection Using UV
Our skilled technicians meticulously handle sensitive components using a dedicated workstation with UV for unparalleled accuracy.
Advanced SMT Assembly Infrastructure
SurfaceMount Technology
At Bendra Aerospace, our SMT (Surface Mount Technology) facility is designed to support high-reliability electronic manufacturing for aerospace, defence, and industrial application
Advanced Reflow Soldering Process
Our Reflow Oven system ensures reliable and defect-free soldering of SMT components through precision thermal profiling and controlled heat distribution. The multi-zone configuration supports stable soldering performance for fine-pitch and high-density PCB assemblies used in mission-critical electronics.
High-Precision Pick & Place Capability & Stencil Printer
The SMT line is integrated with high-speed Pick & Place machines capable of accurately placing a wide range of electronic components, from miniature chip components to complex BGA packages. The system is optimized for both prototype development and batch production requirements
QUALITY & INSPECTION
Advanced Inspection & Testing
X-Ray with Void Measurement
The X-Ray Inspection Machine is used to inspect hidden solder joints and internal connections of PCB assemblies without damaging the board. It is especially critical for BGA, QFN, and high-density electronic packages used in defence and aerospace system
Automated Optical Inspection
The AOI machine is used for automatic inspection of PCB assemblies to identify manufacturing defects such as missing components, wrong polarity, soldering defects, alignment issues, and short circuits with high precision
Comprehensive testing Facilities
Our comprehensive testing facility is equipped with advanced electrical verification instruments, including dedicated testers, LCR meters, and Digital Multimeters (DMMs), to ensure accurate functionality and quality validation of electronic assemblies. Environmental chambers supporting thermal cycling as per MIL-STD environmental qualification standards enable reliability testing of mission-critical aerospace and defence electronic systems under extreme operating conditions
Additional Services for Enhanced Functionality
BGA Rework Station
A precision rework system used for the removal, replacement, and re-soldering of BGA (Ball Grid Array) and other advanced SMT components without damaging the PCB
Conformal Coating
We offer conformal coating to safeguard our electronic packages from environmental hazards, extending their lifespan and functionality.
Conformal Coating Inspection Using UV
Our skilled technicians meticulously handle sensitive components using a dedicated workstation with UV for unparalleled accuracy










