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Capabilities

Key Capabilities

End-to-end aerospace & defence electronics solutions — from design to deployment.

Design & Engineering

Prototyping

Manufacturing & Assembly

Inspection & Quality

Testing & Validation

In-House Facilities

Advanced SMT Assembly Infrastructure

SurfaceMount Technology

At Bendra Aerospace, our SMT (Surface Mount Technology) facility is designed to support high-reliability electronic manufacturing for aerospace, defence, and industrial applications

Advanced Reflow Soldering Process

Our Reflow Oven system ensures reliable and defect-free soldering of SMT components through precision thermal profiling and controlled heat distribution. The multi-zone configuration supports stable soldering performance for fine-pitch and high-density PCB assemblies used in mission-critical electronics

High-Precision Pick & Place Capability & Stencil Printer

The SMT line is integrated with high-speed Pick & Place machines capable of accurately placing a wide range of electronic components, from miniature chip components to complex BGA packages. The system is optimized for both prototype development and batch production requirements

Advanced Inspection & Testing

X-Ray with Void Measurement

The X-Ray Inspection Machine is used to inspect hidden solder joints and internal connections of PCB assemblies without damaging the board. It is especially critical for BGA, QFN, and high-density electronic packages used in defence and aerospace systems

Automated Optical Inspection

The AOI machine is used for automatic inspection of PCB assemblies to identify manufacturing defects such as missing components, wrong polarity, soldering defects, alignment issues, and short circuits with high precision.

Comprehensive testing Facilities

Our comprehensive testing facility is equipped with advanced electrical verification instruments, including dedicated testers, LCR meters, and Digital Multimeters (DMMs), to ensure accurate functionality and quality validation of electronic assemblies. Environmental chambers supporting thermal cycling as per MIL-STD environmental qualification standards enable reliability testing of mission-critical aerospace and defence electronic systems under extreme operating conditions

Additional Services for Enhanced Functionality

BGA Rework Station

A precision rework system used for the removal, replacement, and re-soldering of BGA (Ball Grid Array) and other advanced SMT components without damaging the PCB

Conformal Coating

 We offer conformal coating to safeguard our electronic packages from environmental hazards, extending their lifespan and functionality.

Conformal Coating Inspection Using UV

Our skilled technicians meticulously handle sensitive components using a dedicated workstation with UV for unparalleled accuracy.

Box Building

Our expertise extends beyond PCB assembly, encompassing complete box-build solutions with mechanical assembly, ensuring a fully functional final product.

Advanced SMT Assembly Infrastructure

SurfaceMount Technology

At Bendra Aerospace, our SMT (Surface Mount Technology) facility is designed to support high-reliability electronic manufacturing for aerospace, defence, and industrial application

Advanced Reflow Soldering Process

Our Reflow Oven system ensures reliable and defect-free soldering of SMT components through precision thermal profiling and controlled heat distribution. The multi-zone configuration supports stable soldering performance for fine-pitch and high-density PCB assemblies used in mission-critical electronics.

High-Precision Pick & Place Capability & Stencil Printer

The SMT line is integrated with high-speed Pick & Place machines capable of accurately placing a wide range of electronic components, from miniature chip components to complex BGA packages. The system is optimized for both prototype development and batch production requirements

QUALITY & INSPECTION

Advanced Inspection & Testing

X-Ray with Void Measurement

The X-Ray Inspection Machine is used to inspect hidden solder joints and internal connections of PCB assemblies without damaging the board. It is especially critical for BGA, QFN, and high-density electronic packages used in defence and aerospace system

Automated Optical Inspection

The AOI machine is used for automatic inspection of PCB assemblies to identify manufacturing defects such as missing components, wrong polarity, soldering defects, alignment issues, and short circuits with high precision

Comprehensive testing Facilities

Our comprehensive testing facility is equipped with advanced electrical verification instruments, including dedicated testers, LCR meters, and Digital Multimeters (DMMs), to ensure accurate functionality and quality validation of electronic assemblies. Environmental chambers supporting thermal cycling as per MIL-STD environmental qualification standards enable reliability testing of mission-critical aerospace and defence electronic systems under extreme operating conditions

Additional Services for Enhanced Functionality

BGA Rework Station

A precision rework system used for the removal, replacement, and re-soldering of BGA (Ball Grid Array) and other advanced SMT components without damaging the PCB

Conformal Coating

 We offer conformal coating to safeguard our electronic packages from environmental hazards, extending their lifespan and functionality.

Conformal Coating Inspection Using UV

Our skilled technicians meticulously handle sensitive components using a dedicated workstation with UV for unparalleled accuracy

Box Building

Our expertise extends beyond PCB assembly, encompassing complete box-build solutions with mechanical assembly, ensuring a fully functional final product