PRODUCTION
Production by the word here means the fabrication of avionics packages that we are dealing with. It is fabricated as per our client’s requirements. Production of avionics packages here is a sophisticated and well-structured process. Process generally includes visual inspection of components and PCB upon receiving. Sorting of the respective components is done after VI. Also, PCB is thoroughly inspected to ensure there are no faults present. Visually Cleared PCBs are then cleaned and baked at required temperature. At the same time visually cleared components (Active & Passive components) are tinned. SMD components are wired through reflow process. After the completion of wiring, the wired PCB is then once again inspected to check whether the components are wired accurately with flight requirements. Chassis mounting is very next process which is done using mechanical standards. After that it is inspected and if found alright, then goes to testing section where the performance parameters are tested to find whether it meets the required specification. For testing here, we use most sophisticated instruments and checkouts in order to do the test efficient and time bound. After this stage testing, the PCB is cleaned and baked at required temperature and then inspected. After inspection, PCB is filleted with RTV and conformal coating is applied. When the coating dried up, PCB is then taken for final assembly and final performance testing. If found the performance parameters within specification, final QC inspection is conducted.
REFLOW PROCESS
Reflow process is the main process in PCB soldering while considering SMT. As SMD has been playing a major role in today’s PCB soldering and integration scenario, reflow process is more significant than conventional hand soldering. Briefly, this process is to mount the tiny surface mount devices on its specified contact pad by applying solder paste and controlled heat through various zones. The zone of a reflow machine represents thermal profile. A conventional machine has four zones and each zone has a different thermal profile and they are preheat thermal soak, reflow and cooling zone. For getting more reliable and strong reflow process, industries depend on reflow oven with more number of zones rather than four number.
For depositing the solder paste on PCB to get electrical connections, stencil printing is done. After that components are placed in its respective place by pick and place machine.
Here, Bendra Aerospace PVT LTD is equipped with Stencil Printer, SMT Pick & Place Machine & reflow oven which can do the process with high precision.
